Many thermal issues can be avoided or resolved when circuit board designs are optimized for thermal management. Optimizing PCBs for thermal management has proven to ensure reliability, accelerate product launch timeline and reduce overall cost. CFD in electronics is used to predict airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies and power electronics.
Its mainly divided into 2 categories;
Air cooled electronics (active & passive) - this dissipates heat through natural convection or forced airflow, providing effective thermal management without the need for additional cooling systems.
Liquid cooled electronics - this utilizes a circulating liquid coolant to efficiently dissipate heat, offering enhanced thermal performance and allowing for more compact and densely packed electronic systems.