Thermal deformation analysis is crucial in thermal engineering simulation. It predicts and addresses temperature-induced structural integrity issues, mechanical performance concerns, and precision manufacturing challenges.

In electronic devices, such as circuit boards and semiconductor packages, temperature fluctuations can cause significant thermal expansion and contraction. This phenomenon, known as thermal cycling, may lead to solder joint failures, electrical connection issues, and long-term reliability concerns. Thermal simulation helps identify potential failure points and optimize the design to ensure reliable electronic operation.